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Cryogenic diode glass shell profile

News Sdate : 2013-09-24     Penster :     News Source :
News Short Memos : Cryogenic diode glass shell sealing temperature 40 ℃ lower than the market widely used material in low temperature, due to the high sealing temperature, diode performance ultra poor, so the temperature diode glass shell of fuses, chip performance influenc

Introduction:

Cryogenic diode glass shell, technical invention patent. Its raw materials including:, SiO224 PbO70-73.5% - 73.5%, K2O1. 5-2.55%.

Advantages:

Cryogenic diode glass shell sealing temperature 40 ℃ lower than the market widely used material in low temperature, due to the high sealing temperature, diode performance ultra poor, so the temperature diode glass shell of fuses, chip performance influence is small, ultra-low temperature diode low temperature sealing glass shell, can lead to decreases in the enterprise energy consumption low sealing temperature, can make the production time of the diode, thus improve the production efficiency.



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